अमूर्त

Microstructure, indentation creep and mechanical properties of Sn-Sb rapidly solidified alloys

A.El-Bediwi, K.M.Ismail, M.Kamal


Microstructure, creep behavior, elastic modulus and internal friction of Sn100-x–Sbx (X=2.2, 10 and 50 wt.%) rapidly solidified alloys have been investigated. Creep behavior of Sn- Sb alloys was studied by long time Vickers indentation testing at room temperature. Stress exponent value of Sn- Sb alloys were determined using Mulheam–Tabor method. Exponents values of Sn- Sb alloys in the range of 5.48–12.57 which in good agreement with the values of Sn based alloys reported in the literature. Elastic modulus of Sn100-x–Sbx (X=2.2, 10 and 50 wt.%) rapidly solidified bearing solder alloys increased but internal friction decreased with Sb content increased.


में अनुक्रमित

  • कैस
  • गूगल ज्ञानी
  • जे गेट खोलो
  • चीन राष्ट्रीय ज्ञान अवसंरचना (सीएनकेआई)
  • उद्धरण कारक
  • ब्रह्मांड IF
  • इलेक्ट्रॉनिक जर्नल्स लाइब्रेरी
  • रिसर्च जर्नल इंडेक्सिंग की निर्देशिका (डीआरजेआई)
  • गुप्त खोज इंजन लैब्स
  • आईसीएमजेई

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